Process for making a compliant thermally conductive compound

US5213704A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Herbert R. Anderson, Jr. · Patterson, US
• Richard B. Booth · Pflugerville, US
• Lawrence D. David · Durham, US
• Mark Neisser · Whitehouse Station, US
• Harbans S. Sachdev · Wappingers Falls, US
• Mark A. Takacs · Poughkeepsie, US

Key dates

• Filing date: Sep 13, 1991
• Grant date: May 25, 1993
• Expiry date: Sep 13, 2011

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09K5/08
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A process for making a compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.