Method for aligning wafers within a semiconductor wafer cassette
US5217341A · kind A · utility
10Cited by
14References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 1992 |
| Grant date | Jun 8, 1993 |
| Priority date | — |
| Expiry date | Feb 10, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/138
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improvement which allows precise positioning of wafers within cassettes in preparation for removal of the wafers by automated equipment. The improvement includes mounting two sawtooth jigs upon the surface upon which the cassette tray is to be placed which extend up into the cassette. Wafers within the cassette rest within the precisely aligned grooves of the sawtooth jigs. When the cassette is placed upon the surface, automated equipment can readily remove the precisely aligned wafers from the cassette.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.