Method for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication process
US5219765A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 1990 |
| Grant date | Jun 15, 1993 |
| Priority date | — |
| Expiry date | Jul 6, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/975
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method for manufacturing a highly reliable semiconductor device without waste by incorporating predetermined functions into a wafer in a wafer completion process, aging the wafer in a wafer aging process, distinguishing between non-defective and defective chips in a probe inspection process, separating chips in the wafer one by one in a dicing process, sorting out the chips into non-defective and defective chips in a selection process, then analyzing failure information and feeding back the result of the analysis to the wafer completion process in a feedback process, thereby quickly analyzing and repairing a failure process on reliability in the wafer completion process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.