Shingo Yorisaki
8Patents
3h-index
19Co-inventors
54Inventor score
Filing activity: Jul 6, 1990 → Aug 10, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5219765A | Method for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication process | Emerging Cross-Sectional Technologies | 124 | Expired |
| US7776626B2 | Manufacturing method of semiconductor integrated circuit device | Electricity | 8 | Expired |
| US7271015B2 | Manufacturing method of semiconductor integrated circuit device and probe card | Physics | 6 | Expired |
| US7598100B2 | Manufacturing method of semiconductor integrated circuit device | Physics | 3 | Expired |
| US8357933B2 | Manufacturing method of semiconductor integrated circuit device | Electricity | 3 | Active |
| US7901958B2 | Fabrication method of semiconductor integrated circuit device | Electricity | 2 | Active |
| US7407823B2 | Manufacturing method of semiconductor integrated circuit device | Physics | 1 | Active |
| US7517707B2 | Manufacturing method of semiconductor integrated circuit device and probe card | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.