Method for analyzing organic additives in an electroplating bath
US5223118A · kind A · utility
42Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 1991 |
| Grant date | Jun 29, 1993 |
| Priority date | — |
| Expiry date | Mar 8, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A direct method of analyzing brighteners and levelers used in metal electroplating baths. The method is based on the differential adsorption of these additives on a working electrode during a sequence of steps prior to and during metal plating. The sensitivity of the method allows for the determination of both brightener and leveler in the same sample without cyclic processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.