Reroute strategy for high density substrates
US5224022A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 1990 |
| Grant date | Jun 29, 1993 |
| Priority date | — |
| Expiry date | May 15, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0292
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayered electrical interconnect circuit whereby interconnect lines, placed in channel regions throughout a rerouting substrate, function to reroute densely packaged electrical components via geometrically uniform spot links placed upon only the surface layer within each channel region. The interconnect circuit has closely spaced parallel X-and Y-lines orthogonal to one another, each X- and Y-line placed within horizontal and vertical channel regions, respectively, such that electrical connections between closely spaced large-scale integrated circuits or discrete electrical components can be rerouted with a combination of one or more X- and/or Y-lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.