William Weigler
4Patents
2h-index
8Co-inventors
37Inventor score
Filing activity: May 15, 1990 → Mar 16, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5220490A | Substrate interconnect allowing personalization using spot surface links | Electricity | 49 | Expired |
| US5224022A | Reroute strategy for high density substrates | Electricity | 19 | Expired |
| US7353983B2 | Vertical removal of excess solder from a circuit substrate | Electricity | 0 | Expired |
| US7300820B2 | Adhesive assembly for a circuit board | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.