Resin encapsulated pin grid array and method of manufacturing the same
US5233225A · kind A · utility
12Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 1991 |
| Grant date | Aug 3, 1993 |
| Priority date | — |
| Expiry date | Aug 23, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.