Method for planarizing semiconductor wafers with a non-circular polishing pad
US5234867A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 1992 |
| Grant date | Aug 10, 1993 |
| Priority date | — |
| Expiry date | May 27, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D11/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for planarizing semiconductor wafers in its preferred form includes a rotatable platen for polishing a surface of the semiconductor wafer and a motor for rotating the platen. A non-circular pad is mounted atop the platen to engage and polish the surface of the semiconductor wafer. A polishing head holds the surface of the semiconductor wafer in juxtaposition relative to the non-circular pad. A polishing head displacement mechanism moves the polishing head and semiconductor wafer across and past a peripheral edge of the non-circular pad to effectuate a uniform polish of the semiconductor wafer surface. Also disclosed is a method for planarizing a semiconductor surface using a non-circular polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.