Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization
US5235995A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 1991 |
| Grant date | Aug 17, 1993 |
| Priority date | — |
| Expiry date | Mar 6, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are apparatuses and methods for improved processing of semiconductor wafers and the using vapor phase processing chemicals, particularly aqueous hydrofluoric acid etchants. Homogeneous vapor mixtures are generated from homogeneous liquid mixtures. Means for recirculating, mixing and agitating the liquid phase reactants are provided. In some embodiments the liquid phase is advantageously circulated through a chemical trench within the processing bowl. Exposure of wafers to vapors from the chemical trench can be controlled by a vapor control valve which is advantageously the bottom of the processing chamber. The wafer is rotated or otherwise moved within the processing chamber to provide uniform dispersion of the homogeneous reactant vapors across the wafer surface and to facilitate vapor circulation to the processed surface. A radiative volatilization processor can be utilized to volatilize reaction by-products which form under some conditions. The apparatuses provide efficient uniform etching with low particle count performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.