Surface-heating apparatus and surface-treating method
US5240556A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 1992 |
| Grant date | Aug 31, 1993 |
| Priority date | — |
| Expiry date | Jun 3, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to this invention, a surface-treating apparatus capable of etching an object to be treated with high accuracy, suppressing discharging of a harmful gas deposited on the etched object in the air, and preventing the surface of the object from deposition/ attachment of reaction products and droplets is disclosed. The surface-treating apparatus includes a first process chamber for etching a loaded object to be treated by an activated etching gas, an exhausting member for setting the first process chamber at a low pressure, a cooling means for cooling the object loaded in the first process chamber, a second process chamber in which the object etched by the first process chamber is loaded, an exhausting member for setting the second process chamber at a low pressure, and an heating member for annealing the object loaded in the second process chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.