Chemically cured low temperature polyimides
US5248760A · kind A · utility
12Cited by
29References
42Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 25, 1991 |
| Grant date | Sep 28, 1993 |
| Priority date | — |
| Expiry date | Jan 25, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G73/1028
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention comprises curing polyamic acid solutions into polyimide solutions by adding a hydrophilic reagent to a polyamic acid solution. The hydrophilic reagent is selected to have little or no reactivity with amines or carboxylic acids, and is of the type that will react with water to form by-products that shift the equilibrium between polyamic acid as a reactant and polyimide and water as products toward the production of polyimide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.