System and method for applying a liquid
US5252137A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Sep 12, 1991 |
| Grant date | Oct 12, 1993 |
| Priority date | — |
| Expiry date | Sep 12, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A liquid applying system according to the present invention comprises a liquid supply source and a nozzle communicating with the liquid supply source. The nozzle comprises a liquid storing portion for storing a liquid supplied from the liquid supply source, a number of small passages communicating with the liquid storing portion, each of the small passages having a transverse section which is smaller than that of the liquid storing portion, and a slit-like passage communicating with the small passages, in which liquids from the small passages flow together and from which the liquids are continuously discharged like a curtain toward a semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.