Copper electroplating solutions and processes
US5252196A · kind A · utility
64Cited by
11References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1991 |
| Grant date | Oct 12, 1993 |
| Priority date | — |
| Expiry date | Dec 5, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Compositions and processes for electrolytic plating. The compositions are characterized by critical amounts of one or more brightening and leveling agents. The compositions are particularly useful for plating through hole walls of printed circuit boards, including through holes having an aspect ratio equal or greater than about ten to one.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.