Electrostatic chuck and plasma apparatus equipped therewith
US5255153A · kind A · utility
55Cited by
4References
16Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 17, 1991 |
| Grant date | Oct 19, 1993 |
| Priority date | — |
| Expiry date | Jul 17, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N13/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck having an electrostatic holding member arranged on an upper surface of the chuck main body for holding a semiconductor device during a plasma etching process. The electrostatic holding member includes a pair of insulating polyimide members and a conductive member interposed between the polyimide members. In operation, a voltage is applied to the first conductive member in order to generate static electricity to be applied to the electrostatic holding member for holding the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.