Apparatus for interlayer planarization of semiconductor material
US5257478A · kind A · utility
212Cited by
4References
9Claims
0Family size
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Key dates
| Filing date | Jan 31, 1992 |
| Grant date | Nov 2, 1993 |
| Priority date | — |
| Expiry date | Jan 31, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/22
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A pad for planarizing the surface of a semiconductor wafer. The pad includes at least two layers. One layer has a hydrostatic modulus which is different from the hydrostatic modulus of the other pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.