Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film
US5273938A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1992 |
| Grant date | Dec 28, 1993 |
| Priority date | — |
| Expiry date | Apr 30, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A low cost manufacturing method is used to fabricate a small multichip semiconductor device (30). In one embodiment, a pattern of conductive traces (13) is formed on a film of transfer material (12). A first semiconductor die (15) is interconnected to the traces and a resin body (20) is formed around the first die and one side of the traces. The film of transfer material forms, at this stage of the process, one side of the first package. The film of transfer material is then peeled from the pattern of conductive traces and the first resin body to expose the other side of the traces. A second semiconductor die (23) is interconnected to the exposed side of the traces. A second resin body (25) is formed around the second die and portions of the exposed traces. Solder balls (26) are coupled to the exposed portions of the traces to establish external electrical connections to each die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.