Method of assembling micromechanical sensors

US5273939A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Rolf Becker · Rheydt, DE
• Klaus Jaeckel · Reutlingen, DE
• Jiri Marek · Reutlingen, DE
• Frank Bantien · Ditzingen, DE
• Helmut Baumann · Gomaringen, DE
• Kurt Weiblen · Metzingen, DE
• Martin Willmann · Reutlingen, DE

Key dates

• Filing date: Jan 30, 1992
• Grant date: Dec 28, 1993
• Expiry date: Jan 30, 2012

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/48227
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method is proposed for assembling micromechanical sensors, in particular Hall sensors, or pressure or acceleration sensors, in which at least one silicon sensor element is applied to a substrate. The at least one silicon sensor element is joined to the substrate via at least one assembly pedestal, the cap faces of which are kept small compared with the surface of the silicon sensor element, so that a gap exists between the substrate and the silicon sensor element except for the region of the at least one assembly pedestal.