Method for controlling evaporation for vapor deposition
US5277938A · kind A · utility
8Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 1991 |
| Grant date | Jan 11, 1994 |
| Priority date | — |
| Expiry date | Sep 3, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/30
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a method and an apparatus by means of which a material is vaporized in a treatment chamber by means of an electron beam. Due to controlling the inhomogenity of power distribution over the working area of the beam it becomes possible to prevent local overheating of the target material and thus of a deformation of the target surface. This is realized by oscillating the beam around its working point. The amplitude of the oscillation is, thereby, of almost a few beam diameters and this oscillation is superimposed on the momentarily working position of the beam on the target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.