Base-soluble polyimide release layers for use in microlithographic processing
US5281690A · kind A · utility
54Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 1989 |
| Grant date | Jan 25, 1994 |
| Priority date | — |
| Expiry date | Mar 30, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Base-soluble release layer compositions for microlithographic processing, comprising nonamic acid functionalized polyamic acid/imide resins are disclosed. These materials permit concurrent lithographic development of photoresist and release layers. They also afford effective lift-off, by alkaline media, even after high imidization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.