Cooling structures and package modules for semiconductors
US5287001A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 1992 |
| Grant date | Feb 15, 1994 |
| Priority date | — |
| Expiry date | Apr 24, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02476
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Cooling structure for direct heat transfer between an active layer of a chip in which electric elements are formed and a heat sink are disclosed. The inventive cooling structure consists of a current/voltage supply level, with metal structures and insulation spacers and/or layers, partly covered by an insulation layer and followed by a heat transfer structure. A heat transfer bridge is in thermal connection with the heat transfer structure that provides for heat flux between the inventive cooling structure and the heat sink. The inventive cooling structure of this invention can be used with semiconductor devices and/or with opto-electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.