Deposition apparatus using a perforated pumping plate
US5292554A · kind A · utility
65Cited by
10References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1992 |
| Grant date | Mar 8, 1994 |
| Priority date | — |
| Expiry date | Nov 12, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68721
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a deposition apparatus, a barrier is used to separate a process gas section from the section of the chamber below the substrate on which a metal layer is deposited. The substrate is supported on a support. During an unloading stage, purge gas is introduced into the chamber below the substrate. To prevent the substrate from being moved on the support by the purge gas, the barrier is perforated so that the process gas can flow through the barrier and into a vacuum manifold system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.