Semiconductor device with a plurality of face to face chips
US5296737A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 1991 |
| Grant date | Mar 22, 1994 |
| Priority date | — |
| Expiry date | Sep 6, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L24/86
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprises a plurality of semiconductor chips; electrodes formed on circuit surfaces of said plurality of semiconductor chips; inner leads made of a metal foil and bonded at first ends thereof to the electrodes, outer leads each having a predetermined surface at a first end thereof bonded to a second end of at least one of the inner leads, and a sealing material sealing said plurality of semiconductor chips, the electrodes, the inner leads, and part of each of the outer leads. The semiconductor chips are laminated in such a manner that those surfaces of the semiconductor chips on which their respective circuits are formed are disposed in facing relation to each other. This provides a semiconductor device which is excellent in assembling efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.