No-clean soldering flux and method using the same
US5297721A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 1992 |
| Grant date | Mar 29, 1994 |
| Priority date | — |
| Expiry date | Nov 19, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3618
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A no-clean soldering flux consists essentially of one or more halide-free, water soluble activators in an aggregate amount not exceeding about 5% by weight of the flux, a water soluble fluorinated surfactant in an amount not exceeding about 1% by weight of the flux, and water. The flux is substantially VOC-free and is particularly useful in a method of producing soldered printed wiring assemblies with minimal residual ionic contamination, so that post-soldering cleaning of the assemblies is unnecessary. The absence of significant amounts of VOC's and the elimination of post-soldering cleaning result in substantial environmental and production-related benefits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.