David Blumel
8Patents
8h-index
6Co-inventors
58Inventor score
Filing activity: Jun 3, 1985 → Sep 14, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4672021A | Contrast enhancement layer composition with naphthoquinone diazide, indicator dye and polymeric binder | Physics | 106 | Expired |
| US6228678A | Flip chip with integrated mask and underfill | Electricity | 68 | Expired |
| US6228681A | Flip chip having integral mask and underfill providing two-stage bump formation | Electricity | 43 | Expired |
| US6194788A | Flip chip with integrated flux and underfill | Emerging Cross-Sectional Technologies | 36 | Expired |
| US5571340A | Rosin-free, low VOC, no-clean soldering flux and method using the same | Performing Operations; Transporting | 26 | Expired |
| US5297721A | No-clean soldering flux and method using the same | Performing Operations; Transporting | 24 | Expired |
| US4777111A | Photographic element with diazo contrast enhancement layer and method of producing image in underlying photoresist layer of element | Physics | 12 | Expired |
| US6323062A | Wafer coating method for flip chips | Electricity | 10 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.