Line width control in a radiation sensitive polyimide
US5300403A · kind A · utility
75Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1992 |
| Grant date | Apr 5, 1994 |
| Priority date | — |
| Expiry date | Jun 18, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Standard processing techniques for creating a patterned polyimide film from a radiation sensitive polyimide film forming composition are modified to include a post-develop, flood exposure/hardening step which crosslinks precursors of the polyimide film prior to curing. The flood exposure/hardening step prevents pull-back of the wall profile which occurs during the shrinkage of radiation sensitive polyimide film forming composition which occurs during thermal curing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.