Eric D. Perfecto
58Patents
16h-index
110Co-inventors
87Inventor score
Filing activity: Jun 18, 1992 → Nov 17, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5436412A | Interconnect structure having improved metallization | Electricity | 75 | Expired |
| US5300403A | Line width control in a radiation sensitive polyimide | Physics | 75 | Expired |
| US6036809A | Process for releasing a thin-film structure from a substrate | Emerging Cross-Sectional Technologies | 67 | Expired |
| US5549808A | Method for forming capped copper electrical interconnects | Emerging Cross-Sectional Technologies | 65 | Expired |
| US5757079A | Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure | Electricity | 53 | Expired |
| US5898222A | Capped copper electrical interconnects | Electricity | 51 | Expired |
| US9853006B2 | Semiconductor device contact structure having stacked nickel, copper, and tin layers | Electricity | 47 | Active |
| US9396991B2 | Multilayered contact structure having nickel, copper, and nickel-iron layers | Electricity | 46 | Active |
| US5534466A | Method of making area direct transfer multilayer thin film structure | Emerging Cross-Sectional Technologies | 40 | Expired |
| US6183588A | Process for transferring a thin-film structure to a substrate | Emerging Cross-Sectional Technologies | 31 | Expired |
| US6281452A | Multi-level thin-film electronic packaging structure and related method | Emerging Cross-Sectional Technologies | 29 | Expired |
| US5545927A | Capped copper electrical interconnects | Electricity | 28 | Expired |
| US6126761A | Process of controlling grain growth in metal films | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6998327B2 | Thin film transfer join process and multilevel thin film module | Electricity | 20 | Expired |
| US6099935A | Apparatus for providing solder interconnections to semiconductor and electronic packaging devices | Emerging Cross-Sectional Technologies | 20 | Expired |
| US6444919B1 | Thin film wiring scheme utilizing inter-chip site surface wiring | Electricity | 16 | Expired |
| US5747095A | Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages | Electricity | 15 | Expired |
| US6143117A | Process for transferring a thin-film structure to a temporary carrier | Emerging Cross-Sectional Technologies | 14 | Expired |
| US8518741B1 | Wafer-to-wafer process for manufacturing a stacked structure | Electricity | 13 | Active |
| US5705857A | Capped copper electrical interconnects | Electricity | 12 | Expired |
| US6678949B2 | Process for forming a multi-level thin-film electronic packaging structure | Emerging Cross-Sectional Technologies | 12 | Expired |
| US8820612B2 | Injection molded solder process for forming solder bumps on substrates | Electricity | 11 | Active |
| US8381966B2 | Flip chip assembly method employing post-contact differential heating | Performing Operations; Transporting | 11 | Active |
| US5310625A | Process for forming negative tone images of polyimides using base treatment of crosslinked polyamic ester | Physics | 11 | Expired |
| US5464682A | Minimal capture pads applied to ceramic vias in ceramic substrates | Emerging Cross-Sectional Technologies | 9 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.