Endpoint and uniformity determinations in material layer processing through monitoring multiple surface regions across the layer
US5308447A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 1992 |
| Grant date | May 3, 1994 |
| Priority date | — |
| Expiry date | Jun 9, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/26
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Techniques of monitoring and controlling removal or forming of layers of material, such as employed in the manufacture of flat panel displays and integrated circuit wafers. Examples of material removal include the development of a photoresist layer and etching of layers of other material according to a pattern across the surface of the layer. The material removal process is terminated in response to detecting when breakthrough occurs in a preselected number of individual regions across the surface of the layer. A measure of uniformity of processing across the layer surface is obtained from monitoring removal of material in such individual surface regions, and can be used to control the process to improve such uniformity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.