Cylindrical magnetron sputtering system
US5317006A · kind A · utility
31Cited by
2References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 4, 1991 |
| Grant date | May 31, 1994 |
| Priority date | — |
| Expiry date | Oct 4, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/816
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An improved cathode for a sputtering system includes a metal cylinder and strips of material bonded to the inside of the metal cylinder and/or material sprayed onto the inside of the metal cylinder. The strips may have various specified compositions and/or configurations and/or other characteristics which enhance the ability of the sputtering system to deposit films of high temperature superconductor material on substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.