Wafer cooling method and apparatus
US5320982A · kind A · utility
101Cited by
11References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1991 |
| Grant date | Jun 14, 1994 |
| Priority date | — |
| Expiry date | Jul 2, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to a vacuum processing method and apparatus. When a sample is plasma-processed under a reduced pressure, a sample bed is cooled by a cooling medium kept at a predetermined temperature lower than an etching temperature, the sample is held on the sample bed, a heat transfer gas is supplied between the back of the sample and the sample installation surface of the sample bed, and the pressure of the heat transfer gas is controlled so as to bring the sample to a predetermined processing temperature. In this way, a sample temperature can be regulated rapidly without increasing the scale of the apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.