Device for one-sided etching of a semiconductor wafer

US5324410A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Nils Kummer · Ludwigsburg, DE
• Jiri Marek · Reutlingen, DE
• Martin Willmann · Reutlingen, DE
• Guenther Findler · Stuttgart, DE

Key dates

• Filing date: Feb 1, 1993
• Grant date: Jun 28, 1994
• Expiry date: Feb 1, 2013

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68735
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A device for one-sided etching of a semiconductor wafer (silicon wafer) is proposed, which consists in the manner of an etching box of a trough-shaped basic body (3, 23) and a lid (2, 22) which matches the latter hermetically. The lid (2, 22) has on the topside an opening (5, 25) for the passage of the etching liquid. The etching box bears at least two O-rings (7, 8, 27, 28), of which one is arranged centrally in the basic body (3, 23) and the other centrally in the lid (2, 22). The wafer (1) is clamped between the O-rings (7, 8, 27, 28). A wire (10) connected to the wafer by means of a plate of a spring contact (11, 41) is guided out of the etching box through a bore (4) extending through the basic body (3, 23).