Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate
US5347159A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1991 |
| Grant date | Sep 13, 1994 |
| Priority date | — |
| Expiry date | Sep 24, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip having contacts on a front face is provided with a flexible, sheet-like backing element overlying the rear face. Terminals on the backing element are connected to the contacts by leads extending alongside the edges of the chip. The backing element desirably is formed integrally with flaps extending from edges of the backing element, and the leads desirably extend along these flaps. The flaps may be bent upwardly so as to bring the leads to the vicinity of the contacts on the chip. Preferably, the backing element and flaps are preassembled to a box-like element with the backing element overlying the bottom of the box and the flaps extending upwardly along the sides of the box so that the extremities of the leads on the flaps are positioned adjacent the top opening of the box for connection to contacts on a chip inserted into the box. A compliant layer most preferably is provided between the terminals on the backing element and the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.