Patent · US Expired

Integrated circuit package including a heat pipe

US5349237A · kind A · utility

23Cited by

6References

9Claims

0Family size

Assignee

VLSI Technology, Inc. · US

Inventors

Anthony Sayka · San Antonio, US
Mohammad Amir Siddiqui · Greater Noida, IN

Key dates

Filing date	Mar 20, 1992
Grant date	Sep 20, 1994
Priority date	—
Expiry date	Mar 20, 2012

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A plastic-encapsulated integrated circuit includes a package formed of plastic, an integrated circuit embedded in the package, and heat-dissipating means for conducting heat from the integrated circuit, which means include a hermetically sealed container formed of a heat conductive material embedded in the package and extending from the integrated circuit to at least an outer surface of the package, and a volatile fluid disposed in the container. In operation, the volatile fluid absorbs heat from the integrated circuit when it changes from the liquid state to the vapor state, and dissipates heat when it changes from the vapor state to the liquid state.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.