Processing method for wafers
US5357115A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 1993 |
| Grant date | Oct 18, 1994 |
| Priority date | — |
| Expiry date | Aug 20, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67745
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Load lock chambers having a function of detecting positional deviation of wafers are provided in a process chamber of an ion injection apparatus, two on a carrying-in side, and two on a carrying-out side. One load lock chamber on the carrying-in side and one on the carrying-out side are used as a standby. Carrying-in and carrying-out members are outside of the process chamber. Two transfer members are in the process chamber. A dummy wafer stage is formed at a position which can be accessed by the transfer members. Wafers are transferred from load stages by the carrying-in member via the load lock chambers to the process chamber through a double operation line. Loading a wafer on the turn table and unloading a wafer therefrom can be performed simultaneously by operations of the transfer members and. The wafers are similarly carried out of the apparatus in a double operation line. At this time, dummy wafers in the process chamber can be used, if necessary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.