Plastic encapsulated semiconductor device and lead frame
US5357139A · kind A · utility
54Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 1993 |
| Grant date | Oct 18, 1994 |
| Priority date | — |
| Expiry date | Sep 8, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a package for DRAM, plastic is included between the common signal inner leads (bus bar inner leads) and insulating films arranged in the central part of a semiconductor chip. Thus, the deformation of plastic at the upper edge of the common signal inner leads is reduced and no great stress is generated at this portion. Accordingly, plastic cracking can be prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.