Microwave plasma processing process and apparatus
US5364519A · kind A · utility
22Cited by
10References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1993 |
| Grant date | Nov 15, 1994 |
| Priority date | — |
| Expiry date | Apr 30, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32238
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A microwave plasma processing process and apparatus useful in the fabrication of integrated circuit (IC) or similar semiconductor devices, wherein the object or material to be processed, such as a semiconductor wafer, is processed with plasma generated using microwaves transmitted through a microwave transmission window disposed perpendicular to an electric field of the progressive microwaves in the waveguide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.