Integrated circuit package design having an intermediate die-attach substrate bonded to a leadframe
US5365409A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 1993 |
| Grant date | Nov 15, 1994 |
| Priority date | — |
| Expiry date | Jun 4, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package design configuration for an integrated-circuit die includes a leadframe having its bonding fingers connected to the periphery of an electrically-insulated, heat-conductive substrate, formed, for example, of a ceramic material. A number of electrically conductive traces, or bonding islands, serve as intermediate bonding locations for shorter bonding wires connecting bonding pads on the integrated-circuit die to the bonding fingers of the leadframe. The conductive traces serving as bonding islands are formed by deposition of thin-film material using semiconductor fabrication techniques or by deposition of thick-film material using printing techniques. Various shapes and configurations of the conductive traces are available, such as elongated rectangular patterns, or zigzag patterns. Alternatively, the electrically-insulated, heat-conductive ceramic substrate is attached to the die-attach pad of a conventional leadframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.