Clamped carrier for testing of semiconductor dies
US5367253A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 1993 |
| Grant date | Nov 22, 1994 |
| Priority date | — |
| Expiry date | Apr 14, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a technique for testing a singularized semiconductor die prior to packaging the die, thereby allowing for the packaging or other use of only known good die. The invention employs a carrier tray which preferably supports several die carriers which individually support a plurality of dies. Bridge clamps press against rigid covers which bias the dies against the contact members. The die carriers include a housing of ceramic or other workable material. Contact pads on the interior of the package are coupled to exterior leads with conductive traces. The back side of a semiconductor die to be tested is removably mounted to a lid, and the bond pads on the die are aligned with the contact pads on the interior of the package. The lid is attached to the package thereby electrically coupling the contact pads with the bond pads on the die. The package has a configuration which facilitates the handling of the carrier so that the carrier can be conveniently used during burn-in and test procedures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.