Patent · US Expired

Method and an encapsulation for encapsulating electrical or electronic components or assemblies

US5376824A · kind A · utility

7Cited by

4References

8Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Siegfried Rauchmaul · Munich, DE
Hans-Fr. Schmidt · Eurasburg, DE
Juergen Bednarz · Penzberg, DE
Karl-Heinz Horsmann · Munich, DE
Ralf Criens · Munich, DE
Horst Scheffler · Munich, DE
Hanns-Heinz Peltz

Key dates

Filing date	Jan 8, 1992
Grant date	Dec 27, 1994
Priority date	—
Expiry date	Jan 8, 2012

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49172
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A component or assembly is accommodated in a housing formed of at least two joined housing parts. Terminal legs are conducted toward the outside of the housing. In order to enhance a sealing effect, and thus for protection against internal corrosion, an outside encapsulation of a thermoplastic plastic is applied to the housing by injection molding at least in the region of the joints of the housing and in the exit region of the terminal legs. Particularly given the hermetically tight encapsulation of surface-wave filters, encircling sections having a low wall thickness are provided on the housing parts in their peripheral regions, these sections being fused to the outside encapsulation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.