Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices
US5393993A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 1993 |
| Grant date | Feb 28, 1995 |
| Priority date | — |
| Expiry date | Dec 13, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/01335
Abstract
A transition crystal structure is disclosed for providing a good lattice and thermal match between a layer of single crystal silicon carbide and a layer of single crystal gallium nitride. The transition structure comprises a buffer formed of a first layer of gallium nitride and aluminum nitride, and a second layer of gallium nitride and aluminum nitride adjacent to the first layer. The mole percentage of aluminum nitride in the second layer is substantially different from the mole percentage of aluminum nitride in the first layer. A layer of single crystal gallium nitride is formed upon the second layer of gallium nitride. In preferred embodiments, the buffer further comprises an epitaxial layer of aluminum nitride upon a silicon carbide substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.