Plating catalyst formed from noble metal ions and bromide ions
US5395652A · kind A · utility
1Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 1994 |
| Grant date | Mar 7, 1995 |
| Priority date | — |
| Expiry date | Jan 5, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4644
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process and catalyst for electroless plating of metal over a substrate. The process involves providing a catalyst that is the product of reaction of a noble metal with bromide ions where the ratio of bromide ions to noble metal ions is at least 100 to 1 and the noble metal is present in a concentration sufficient to catalyze an electroless plating reaction, contacting a substrate to be plated with the catalyst, and reducing the catalyst prior to or during plating of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.