Fluxless soldering of copper
US5407121A · kind A · utility
34Cited by
9References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 1993 |
| Grant date | Apr 18, 1995 |
| Priority date | — |
| Expiry date | Nov 19, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3489
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of soldering a copper layer without the use of fluxing agents by exposing the copper layer to a fluorine-containing plasma. Solder is then placed onto the surface of the copper layer and reflowed. Reflow can take place at low temperatures, atmospheric pressure and in an inert or oxidizing atmosphere using standard solder reflow equipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.