Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die
US5408190A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1993 |
| Grant date | Apr 18, 1995 |
| Priority date | — |
| Expiry date | Jun 7, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A reusable burn-in/test fixture for discrete die consists of two halves. The first half of the test fixture contains cavity in which die is inserted. Electrical contact with bondpads or bumps on the die is established through an intermediate substrate. When the two halves are assembled, electrical contact with the die is established. The fixture establishes the electrical contact and with a burn-in oven and with a discrete die tester. The test fixture need not be opened until the burn-in and electrical tests are completed. The fixture permits the die to be characterized prior to assembly, so that the die may then be transferred in an unpackaged form. The intermediate substrate may be formed of semiconductor material or of a ceramic insulator. A Z-axis anisotropic conductive interconnect material may be interposed between the intermediate substrate and the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.