Resist compositions
US5422221A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 1994 |
| Grant date | Jun 6, 1995 |
| Priority date | — |
| Expiry date | Feb 16, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0236
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
In a resist composition, a novolak resin including at least one recurring unit of the formula (1): ##STR1## wherein n is an integer of 1 to 4 and m is an integer of 0 to 3, having a weight average molecular weight of 1,000 to 10,000 calculated as polystyrene, and having the hydrogen atom of a hydroxyl group therein replaced by a 1,2-naphthoquinonediazidosulfonyl group in a proportion of 0.03 to 0.27 mol per hydrogen atom serves as an alkali-soluble resin and a photosensitive agent. The composition is uniform in that the photosensitive agent is uniformly incorporated in the novolak resin, and thus forms a uniform resist film. It is a useful positive resist having improved sensitivity, resolution, heat resistance, and film retentivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.