Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects
US5426405A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1994 |
| Grant date | Jun 20, 1995 |
| Priority date | — |
| Expiry date | Dec 29, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10946
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A family of modular hybrid assemblies with high frequency interconnections is effected by a high frequency circuit assembly attached to a motherboard. Each assembly comprises standardized conducting elements and customizable transitions and circuit regions. The customizable transitions can be placed anywhere along the conducting element and are capable of low and high frequency performance. Attachment of the assembly can be effected via a standardized clamping structure which compresses an elastomeric member upon the conducting elements or by bending the conducting elements and soldering on end to attachment sites on the motherboard. Each member of the family of modular hybrid assemblies provides a controlled impedance transition from a transmission line on the circuit assembly to a transmission line on the motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.