Resin molded semiconductor package
US5428248A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 15, 1994 |
| Grant date | Jun 27, 1995 |
| Priority date | — |
| Expiry date | Aug 15, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin molded semiconductor package of which the semiconductor chip is bonded to leads instead of a paddle. This package comprises a semiconductor chip and a lead frame comprising a plurality of board connection leads and a plurality of chip connection leads. The board connection leads are connected to a circuit board and support the semiconductor chip bonded to their surfaces. The chip connection leads extend from individual board connection leads and are electrically connected to the semiconductor chip through a plurality of metal wires. A pair of chip bonding materials bond the semiconductor chip to the surfaces of the board connection leads. A predetermined volume of the package, including the semiconductor chip and the board connection leads and the chip connection leads, is hermetically sealed by a mold resin to form a package body in which the lower surfaces of the board connection leads are exposed to the outside of the lower surface of the package body. The chip bonding material is selected from an insulating double-faced tape and an insulating adhesive of the paste type.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.