High-density interconnect technique

US5429510A · kind A · utility

Assignee

• AEHR TEST SYSTEMS · US

Inventors

• William D. Barraclough · San Ramon, US
• Mikhail A. Alperin · San Francisco, US
• Jeffrey A. Brehm · Mill Valley, US
• John Hoang · Fremont, US
• Patrick M. Shepherd · San Jose, US
• James F. Tomic · Oakland, US

Key dates

• Filing date: Dec 1, 1993
• Grant date: Jul 4, 1995
• Expiry date: Dec 1, 2013

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01R12/721
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A high density interconnect system (30) employs contact fingers (32) on both surfaces (34) and (36) of burn-in PCB (38), feed-through PCB (40) and driver PCB (42). Each of the PCBs (38), (40) and (42) has a card-edge connector (44), (46) and (48). The feed-through PCB (40) has a second card-edge connector (40) and a second set of contact fingers (32), since it mates with both the burn-in PCB (38) and the driver PCB (42). The contact fingers (32) and the card-edge connectors (44), (46), (48) and (50) of each PCB (38), (40) and (42) mate inversely with each other on adjacent PCBs, i.e., the card-edge connector (44) of the burn-in PCB (38) mates with the contact fingers (32) of the feed-through PCB (40), and the card-edge connector (46) of the feed-through PCB (40) mates with the contact fingers (32) of the burn-in PCB (38), for example. The same relationship exists between the card-edge connector (50) of the feed-through PCB (40), the card-edge connector (48) of the driver PCB (42) and the contact fingers (32) of the feed-through PCB(40) and the driver PCB (42).