In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US5433651A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 1993 |
| Grant date | Jul 18, 1995 |
| Priority date | — |
| Expiry date | Dec 22, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/0683
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An in-situ chemical-mechanical polishing process monitor apparatus for monitoring a polishing process during polishing of a workpiece in a polishing machine, the polishing machine having a rotatable polishing table provided with a polishing slurry, is disclosed. The apparatus comprises a window embedded within the polishing table, whereby the window traverses a viewing path during polishing and further enables in-situ viewing of a polishing surface of the workpiece from an underside of the polishing table during polishing as the window traverses a detection region along the viewing path. A reflectance measurement means is coupled to the window on the underside of the polishing table for measuring a reflectance, the reflectance measurement means providing a reflectance signal representative of an in-situ reflectance, wherein a prescribed change in the in-situ reflectance corresponds to a prescribed condition of the polishing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.