Inventor · Ossining, NY, US

Naftali E. Lustig

68Patents
14h-index
76Co-inventors
87Inventor score

Filing activity: Oct 25, 1991 → Apr 24, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US5433651A In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing Physics 473 Expired
US5470661A Diamond-like carbon films from a hydrocarbon helium plasma Emerging Cross-Sectional Technologies 265 Expired
US6573606B2 Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect Electricity 258 Expired
US5337015A In-situ endpoint detection method and apparatus for chemical-mechanical polishing using low amplitude input voltage Physics 130 Expired
US6153043A Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing Electricity 82 Expired
US6020264A Method and apparatus for in-line oxide thickness determination in chemical-mechanical polishing Electricity 62 Expired
US5569501A Diamond-like carbon films from a hydrocarbon helium plasma Emerging Cross-Sectional Technologies 53 Expired
US6632377B1 Chemical-mechanical planarization of metallurgy Electricity 47 Expired
US6375693B1 Chemical-mechanical planarization of barriers or liners for copper metallurgy Electricity 47 Expired
US9502350B1 Interconnect scaling method including forming dielectric layer over subtractively etched first conductive layer and forming second conductive material on dielectric layer Electricity 22 Active
US9601426B1 Interconnect structure having subtractive etch feature and damascene feature Electricity 21 Active
US10177031B2 Subtractive etch interconnects Electricity 19 Active
US9171801B2 E-fuse with hybrid metallization Electricity 17 Active
US8232646B2 Interconnect structure for integrated circuits having enhanced electromigration resistance Electricity 17 Active
US9536830B2 High performance refractory metal / copper interconnects to eliminate electromigration Electricity 13 Active
US8633707B2 Stacked via structure for metal fuse applications Electricity 12 Active
US8030707B2 Semiconductor structure Electricity 12 Active
US5317190A Oxygen assisted ohmic contact formation to N-type gallium arsenide Electricity 12 Expired
US9059170B2 Electronic fuse having a damaged region Electricity 11 Active
US9685404B2 Back-end electrically programmable fuse Electricity 11 Active
US5358899A Oxygen assisted ohmic contact formation to n-type gallium arsenide Electricity 9 Expired
US7488679B2 Interconnect structure and process of making the same Electricity 9 Active
US8129269B1 Method of improving mechanical properties of semiconductor interconnects with nanoparticles Emerging Cross-Sectional Technologies 8 Active
US9142506B2 E-fuse structures and methods of manufacture Electricity 7 Active
US8736020B2 Electronic anti-fuse Electricity 7 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.