Method of molding resin for sealing an electronic device
US5435953A · kind A · utility
49Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1993 |
| Grant date | Jul 25, 1995 |
| Priority date | — |
| Expiry date | Dec 21, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In a method for molding resin to seal an electronic part, a sealed space portion is formed between molding surfaces of an upper mold section and a lower mold section by covering an outer side periphery of a pot, a resin path and a cavity. A resin tablet is heated at its bottom portion and peripheral portion in the pot of the lower mold section to expand upwardly from its top portion. Air and moisture included inside the resin tablet is expelled into the sealed space portion which is evacuated including any air and moisture inside the sealed space portion, whereby the formation of voids in the molded resin body is avoided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.